SCI期刊

Journal Of Electronic Packaging

所属分类：SCI期刊

Journal Of Electronic Packaging期刊基本信息

Journal Of Electronic Packaging中文介绍

《Journal Of Electronic Packaging》是一本由ASME出版商出版的专业工程技术期刊，该刊创刊于1989年，刊期Quarterly，该刊已被国际权威数据库SCIE收录。在中科院最新升级版分区表中，该刊分区信息为大类学科：工程技术 4区，小类学科：工程：电子与电气 4区；工程：机械 4区；在JCR（Journal Citation Reports）分区等级为Q3。该刊发文范围涵盖工程：电子与电气等领域，旨在及时、准确、全面地报道国内外工程：电子与电气工作者在该领域取得的最新研究成果、工作进展及学术动态、技术革新等，促进学术交流，鼓励学术创新。2021年影响因子为1.931，平均审稿速度>12周，或约稿。

Journal Of Electronic Packaging英文介绍

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.

Journal Of Electronic Packaging中科院分区

大类学科	分区	小类学科	分区	Top期刊	综述期刊
工程技术	4区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 ENGINEERING, MECHANICAL 工程：机械	4区 4区	否	否

Journal Of Electronic Packaging期刊近9年JCR分区变化趋势

Journal Of Electronic PackagingJCR分区(JCR2021-2022年分区)

JCR分区等级	JCR所属学科	分区	影响因子
Q3	ENGINEERING, ELECTRICAL & ELECTRONIC	Q3	1.931
	ENGINEERING, MECHANICAL	Q3

Journal Of Electronic Packaging期刊近7年影响因子变化趋势

Journal Of Electronic Packaging期刊的CiteScore值(CiteScore2021-2022年CiteScore值)

CiteScore	SJR	SNIP	学科类别	分区	排名	百分位
3.70	0.493	0.861	大类：Engineering 小类：Mechanics of Materials	Q2	145 / 384	62%
			大类：Engineering 小类：Electrical and Electronic Engineering	Q2	284 / 708	59%
			大类：Engineering 小类：Computer Science Applications	Q2	307 / 747	58%
			大类：Engineering 小类：Electronic, Optical and Magnetic Materials	Q2	122 / 259	53%

Journal Of Electronic Packaging期刊近7年自引率变化趋势